http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101580483-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-00 |
| filingDate | 2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101580483-B1 |
| titleOfInvention | Continuous electroplating method |
| abstract | A method for electroplating copper on an object to be plated, using an insoluble anode as an anode and a cathode as a cathode in a plating tank containing a copper sulfate plating bath, wherein a copper dissolution tank different from the plating tank is provided, The plating bath is circulated between the plating bath and the copper dissolution tank by circulating the plating bath and half the plating bath by a plating bath from the copper dissolution tank and further dissolving the copper salt dissolving salt into the copper dissolution bath to dissolve the plating A plating bath can be moved between the anode and the cathode, and the plating bath can be half-charged to the vicinity of the anode during plating in half the plating bath from the copper dissolution tank to the plating bath, The plating ability which is generated when the copper salt of the copper ion is dissolved to diffuse the copper ion, It is possible to prevent the plating defects due to the components that hinder the plating performance.n n n n Copper sulfate, plating, electroplating |
| priorityDate | 2008-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.