http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101574475-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2014-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101574475-B1 |
| titleOfInvention | Surface-treated copper foil, and copper-clad laminate obtained using surface-treated copper foil |
| abstract | The object of the present invention is to provide a copper foil having good adhesion with an insulating resin base material and having a good etching performance equivalent to that of a non-roughened copper foil, as compared with a non-roughened copper foil. In order to achieve this object, in a surface-treated copper foil obtained by roughening the surface of a copper foil, the surface of the copper foil is roughened with needle-like or plate-like fine irregularities containing a copper composite compound having a maximum length of 500 nm or less And a surface-treated copper foil or the like having a roughened surface. It is preferable that the copper complex compound has a composition of 50 to 99% of copper oxide and a remaining amount of copper oxide and an impurity. |
| priorityDate | 2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.