http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101563765-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2011-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101563765-B1 |
| titleOfInvention | Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor device |
| abstract | The present invention relates to a flip chip type semiconductor backing film for use in a back surface of a semiconductor element flip chip bonded on an adherend, wherein the flip chip type semiconductor back surface film has an elongation at 23 deg. C before thermosetting, (A / B) is in the range of 1 to 8 x 10 3 (% / GPa), where B is the tensile storage modulus at 23 캜 before thermosetting of the film for semiconductor backing. |
| priorityDate | 2010-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.