http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101561855-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66772 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12 |
filingDate | 2008-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2015-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2015-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101561855-B1 |
titleOfInvention | Manufacturing method of SOI substrate |
abstract | It is an object of the present invention to provide a method of manufacturing an SOI substrate including a semiconductor layer that can withstand practical use even when a substrate having a low heat resistance temperature such as a glass substrate is used. n A semiconductor substrate having a bonding layer formed on its surface and having a release layer formed at a predetermined depth and a base substrate having a deformation point of 700 DEG C or less are prepared and the semiconductor substrate and the base substrate are opposed to each other to bond the bonding layer and the base substrate, And a step of separating a part of the semiconductor substrate with the peeling layer as a boundary to form a single crystal semiconductor layer on the base substrate. A substrate which is isotropically contracted at least by heat treatment is used as the base substrate. n n SOI substrate, single crystal semiconductor layer, isotropic shrinkage, heat treatment, thermal expansion coefficient |
priorityDate | 2007-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.