| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-784
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2011-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101560039-B1 |
| titleOfInvention |
Coating adhesives onto dicing before grinding and micro-fabricated wafers |
| abstract |
The manufacturing method of semiconductor wafers into discrete semiconductor dies uses both a dicing step prior to grinding and / or a via hole micro fabrication step, and an adhesive coating step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11266344-B2 |
| priorityDate |
2010-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |