| abstract |
The present invention relates to a method of manufacturing an optoelectronic device comprising the steps of preparing a substrate (1) having a first major surface (2) and a second major surface (3) opposite said first major surface (4) adapted to emit electromagnetic radiation from the front side (5) to the first main side (2) of the substrate (1) (5) of the semiconductor body (4), the cover being formed of an optical member (19) using a closed cavity (18), the cover And the cavity includes the contour of the optical member (19). The present invention also relates to a photoelectric device. n n LIM, transfer molding, compression molding, sealing, thermoplastic |