http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101555396-B1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 |
filingDate | 2009-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2015-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2015-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101555396-B1 |
titleOfInvention | Thermally conductive resin composition |
abstract | The thermally conductive resin composition of the present invention is a thermally conductive resin composition comprising (a) a matrix component, (b) a large-diameter thermally conductive inorganic powder, (c) a thermally conductive inorganic powder having a small particle diameter, and (d) a vulcanizing agent and / The thermally conductive resin composition according to claim 1, wherein the thermally conductive inorganic powder having a small particle size is selected from the group consisting of R (CH 3 ) a Si (OR ') 3-a wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, 1 to 4, and a is 0 or 1, or a partial hydrolyzate thereof, and the amount of the silane compound treated with the partial hydrolyzate is less than that required to cover the entire surface area of the small particle size thermally conductive inorganic powder. . Thus, a thermally conductive resin composition having a low hardness, a high thermal conductivity, a low outgass derived from a surface treatment agent, and a storage stability is obtained even when a large amount of thermally conductive inorganic powder is filled in the resin component. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101861482-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018080013-A1 |
priorityDate | 2008-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.