| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49163 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2013-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101553499-B1 |
| titleOfInvention |
Circuit board, method for forming conductive film, and adhesion improver |
| abstract |
In the conductive film formed by photo-calcining the film made of copper microparticles, the adhesion of the conductive film to the substrate is improved. The circuit board 1 is provided with a circuit having a conductive film 2 and a substrate 3. The circuit board 1 further includes a resin layer 4 between the substrate 3 and the conductive film 2. [ The substrate 3 is made of a non-thermoplastic base material 31. The resin layer 4 contains a thermoplastic resin. The conductive film 2 is formed by photo-firing a film composed of the copper fine particles 21. As a result, the conductive film 2 improves the adhesion to the base material 31 through the resin layer 4. |
| priorityDate |
2012-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |