| abstract |
The present invention relates to thermosetting resin compositions useful in flip chip ("FC") underfill sealant materials, wherein the semiconductor chip is mounted directly on the circuit via solder electrical interconnects. Similarly, the compositions may each comprise a chip size, a chip scale package ("CSP") having a semiconductor chip such as a large scale integration ("LSI") on a carrier substrate, a ball grid such as an array ("BGA"), a land grid array ("LGA"), and the like. |