Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24942 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-546 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-734 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 |
filingDate |
2008-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2015-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101550005-B1 |
titleOfInvention |
Multilayer polyimide film, laminate and metal-clad laminate |
abstract |
The present invention aims at providing a polyimide film having a high flexibility and dimensional stability suitable for a flexible printed wiring board and the like and a laminate and a metal laminate using the same, Wherein the core layer is a non-thermoplastic polyimide having an average linear expansion coefficient of 5 to 20 ppm / 占 폚 at 100 to 200 占 폚, and the cladding layer Is a polyimide having a peeling strength of 3 N / cm or less, wherein the average linear expansion coefficient of the entire film at 100 to 200 캜 is 9 to 30 ppm / 캜, and the average elastic modulus (a) b >) satisfies the following relational expression (1): a > b. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10470303-B2 |
priorityDate |
2007-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |