| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1082 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101545430-B1 |
| titleOfInvention |
Multilayer molded body and method for producing same, electromagnetic shield member, and heat-dissipating member |
| abstract |
The multilayer molded body 1 according to the present invention is a multilayer molded body 1 having at least one of a binder resin and a binder resin / filler composite 21 containing an inorganic filler in an amount of 30 vol% or more and 95 vol% or less and a binder resin / filler composite 21 And an adhesion reinforcing resin layer (11) laminated on the main surface of the substrate. The adhesion reinforcing resin layer 11 is composed mainly of a polyimide resin having a thickness of 50 nm or more and 9 占 퐉 or less, a glass transition temperature of 120 占 폚 or more and less than 260 占 폚, and an aliphatic unit having 3 or more carbon atoms in its main chain. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019098701-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11359064-B2 |
| priorityDate |
2011-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |