Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4875 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-16 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
filingDate |
2013-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2015-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101542765-B1 |
titleOfInvention |
Method of manufacturing semiconductor device, and semiconductor device |
abstract |
Disclosure of the Invention It is an object of the present invention to provide a method of manufacturing a semiconductor device capable of suppressing diffusion of Cu or the like, which is a component of a metal layer, into a substrate with a layer having a good coatability between the substrate and the metal layer, . A step of immersing the substrate 10 in a liquid containing metal ions and attaching the metal catalysts 12a to the surface of the substrate, and immersing the substrate with the metal catalyzers immersed in an electroless plating solution, A step of immersing the substrate in an electrolytic plating solution to form an electroless plated layer (16) on the electroless plated layer using the electroless plated layer as a power supply layer; and a step of forming an electroless plated layer And a step of forming the metal layer 18 with Cu or Ag. This electrolytic plating layer is formed of a material different from that of the metal layer. |
priorityDate |
2012-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |