| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17c6c7da627b7bead7208250127b52c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2014-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07f1be35b08a33a30af8d39b04fd194a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_301e332a1c7b80e9cb013f876ce32eec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c28fceb785920abbfaeab60980c30bd |
| publicationDate |
2015-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101542161-B1 |
| titleOfInvention |
The solder bump structure and method of fabricating the same |
| abstract |
The present invention provides a method of manufacturing a semiconductor device, Forming an insulating layer on at least a portion of the conductive pad and the device; Forming an insulating layer pattern having a cavity for exposing the conductive pad by etching the insulating layer; Forming a solder layer on an entire surface of the conductive pad and the insulating layer pattern; Performing a dewetting process on the solder layer by plasma to form a solder bump which is in direct contact with the conductive pad surrounded by the insulating layer pattern; And removing the insulating layer pattern. The present invention also provides a solder bump structure and a solder bump structure implemented by the method. |
| priorityDate |
2014-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |