http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101539762-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D139-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D139-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-65 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D139-06 |
| filingDate | 2008-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101539762-B1 |
| titleOfInvention | Protective film composition for wafer dicing |
| abstract | The present invention relates to a resin composition comprising at least one resin selected from polyethyloxazoline and polyvinylpyrrolidone; At least one component selected from the group consisting of water-soluble resins and monomers of alcohols; And a protective film composition for wafer dicing comprising water or a mixture of water and an organic solvent as a solvent.n n n Protective film, laser, dicing, water-soluble resin, wafer |
| priorityDate | 2008-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.