http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101538944-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate | 2013-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101538944-B1 |
| titleOfInvention | Compliant multilayered thermally-conductive interface assemblies and memory modules including the same |
| abstract | In accordance with various aspects of the present invention, exemplary embodiments of thermally conductive interface assemblies suitable for use when releasing heat from a component to one or more components of a memory module or other device are disclosed. In an exemplary embodiment, the thermal interface material is disposed on one side or along one side of the stretchable thermally conductive sheet. In another embodiment, the stretchable thermally conductive sheet is bonded to, encapsulated within, or interposed between the first and second layers of the thermal interface material. The stretchable thermally conductive sheet can be a stretchable perforated graphite sheet. The thermal interface material may be a thermally conductive polymer. Perforation holes in the graphite sheet may help to mechanically bond the first and second layers to the graphite sheet and / or form polymer-to-polymer bonds that may help to provide thermal conduction between the first and second layers . In another embodiment, the thermally conductive interfacial assembly may include a stretchable thermal diffuser generally having first and second sides and one or more through holes extending through the thermal diffuser from the first side to the second side. The stretchable thermal diffusers may be interposed between the first and second layers of the soft thermal interface material. A portion of the soft thermal interface material may be disposed within one or more perforation holes. The thermally conductive interface assembly may be deployable relative to one or more components of the memory module to provide a thermal conduction path from the at least one component to the first layer of soft thermal interface material. |
| priorityDate | 2009-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.