Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03845 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05176 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0348 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03444 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2012-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2015-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101538262-B1 |
titleOfInvention |
Semiconductor constructions having through-substrate interconnects, and methods of forming through-substrate interconnects |
abstract |
Some embodiments include methods of forming interconnects through semiconductor substrates. The opening may be formed to extend to the middle through the semiconductor substrate, and a portion of the interconnect may be formed in the opening. Other openings may be formed to extend from the second side of the substrate to the first portion of the interconnect, and other portions of the interconnect may be formed in such openings. Some embodiments include a first portion of a penetrating substrate interconnect that extends partially from a first side of a substrate through a semiconductor substrate; And semiconductor structures having a second portion extending from a second side of the substrate and having a plurality of discrete conductive fingers extending all the way to the first portion of the interconnect. |
priorityDate |
2011-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |