http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101534905-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2011-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101534905-B1 |
| titleOfInvention | Layered structure and light-sensitive dry film used in same |
| abstract | A multilayer structure comprising at least a substrate (1) and a photosensitive resin layer or a cured coating layer (2) containing an inorganic filler (3) formed on the substrate, wherein the photosensitive resin layer or the cured coating layer as a whole has a linear thermal expansion coefficient It is possible to provide a photosensitive resin layer or an inorganic filler in the photosensitive resin layer or the cured coating layer which is excellent in adhesion between the photosensitive resin layer or the cured coating layer and the substrate and does not cause peeling at the time of PCT, Is lower on the side in contact with the substrate, and higher on the surface side remote from the substrate. Preferably, the content of the inorganic filler in the photosensitive resin layer or the cured coating layer is gradually increased or gradually increased from the side in contact with the substrate toward the surface side remote from the substrate. The photosensitive dry film having the photosensitive resin layer is preferably used as a solder resist or an interlayer resin insulating layer of a printed wiring board. |
| priorityDate | 2010-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 517.