http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101534796-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-2208 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-24 |
| filingDate | 2013-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101534796-B1 |
| titleOfInvention | The Antenna of manufacture method using Plastic platting solution |
| abstract | The present invention forms a pattern by laser masking a surface layer of a plastic material of a plastic material such as PC (Poly Carbonate) PI (Poly Imide), PET (Polyethylene), and PP (Polypropylene) The present invention relates to a method of manufacturing an antenna using a plastic material that provides electric and electronic characteristics by forming a metal layer only in a laser processing region through a pretreatment process of plating, The detailed procedure includes a first step of cutting a plastic or film disk including the via hole so as to be energized according to the NFC antenna size; A second step of forming a fine crack on the surface of the plastic plate or the original plate of the plastic plate, which is cut according to the antenna size, so that the seed can be seated upon plating according to the antenna pattern; A third step of irradiating laser-masked plastic or film with a chemical agent to change the physical properties of the film, and then applying a daisy to the surface of the film, thereby plating a seed of plating to coat a metal film having adhesion; And a fourth step of forming the metal film through the plating process only on the laser masked portion of the seed of the etched plastic or film original plate. Accordingly, the present invention can be applied to a film material such as PC (Poly Carbonate) PI (Poly Imade) and the like. By realizing a pattern in a general injection structure and using thinner and better electric and electronic properties, And provides an improvement effect. |
| priorityDate | 2013-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.