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filingDate 2008-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101526021-B1
titleOfInvention Printing processes for patterned conductors, semiconductors and dielectric materials
abstract The present invention relates to a method of printing features with an ink comprising a material precursor. In some embodiments, the material comprises an electrically active material such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material comprises a dielectric. Embodiments provide improved printing process conditions that allow more precise control of the shape, cross-section, and dimensions of printed lines or other features. The composition (s) and / or method (s) enhance the control of pinning by increasing the viscosity and mass loading of the components in the ink. Thus, an exemplary method includes printing a pattern on a substrate with an ink comprising a metal precursor and a solvent; Precipitating the precursor into the pattern to form a pinning line; Sufficiently evaporating the solvent to form a feature of the material precursor formed by the pinning line; And converting the material precursor into a patterned material.n n n n Patterned conductors, semiconductors, dielectrics, printing processes
priorityDate 2007-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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