http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101525234-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6776 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67201 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 |
| filingDate | 2012-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101525234-B1 |
| titleOfInvention | Semiconductor Substrate Surface Etching Device, and Method of Manufacturing Semiconductor Substrate Whereon Uneven Shapes Are Formed Upon Surface Using Said Device |
| abstract | An object of the present invention is to provide an apparatus for etching a surface of a semiconductor substrate capable of coping with mass production while using a gas causing an exothermic reaction with the semiconductor substrate as an etching gas. A transfer mechanism for transferring a tray containing a semiconductor substrate from the load lock chamber to the unload lock chamber through the load lock chamber and a transfer mechanism for transferring the semiconductor substrate and / There is provided a surface etching apparatus for a semiconductor substrate having a cooling mechanism for cooling a tray, the surface etching apparatus having a plurality of nozzles for ejecting an etching gas toward the surface of a semiconductor substrate accommodated in the tray in the etching chamber. |
| priorityDate | 2011-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.