http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101525098-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-62 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F17-235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F17-13 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01F17-235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
filingDate | 2013-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101525098-B1 |
titleOfInvention | Chemical mechanical polishing (cmp) composition for shallow trench isolation (sti) applications and methods of making thereof |
abstract | Methods for removing, reducing or treating trace metal contaminants and small and fine-sized cerium oxide particles from cerium oxide particles, cerium oxide slurries or chemical mechanical polishing (CMP) compositions for shallow trench isolation (STI) processes are used. (Shallow trench isolation) process and application using a CMP polishing composition prepared using a treated chemical mechanical polishing (CMP) composition or a treated cerium oxide particle or a treated ceria slurry. A substrate containing at least one surface is polished. Reduced trace metal ion contamination in shallow trench isolation (STI) CMP polishing and reduced nano-size particle related defects due to reduced very small and fine cerium oxide particles have been observed. |
priorityDate | 2012-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.