http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101524624-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2013-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101524624-B1
titleOfInvention Additive composition of high aspect ratio polishing slurry and high aspect ratio polishing slurry composition comprising the same
abstract The present invention relates to a slurry additive composition for high stage abrasive and a slurry composition for high stage abrasive comprising the same, wherein the slurry additive composition for high stage abrasive according to the present invention and the slurry composition for high speed abrasive comprising the same, The step of the patterned wafer having a portion of the patterned wafer is removed and planarized, and after the planarization, the polishing surface is protected as the polishing rate becomes very slow. Also, the high-speed polishing performance of the high-stage concave-convex portion is maintained regardless of the content of the additive composition and the automatic polishing stop function is controlled according to the content of the additive composition, so that the process margin is excellent and the production time is shortened.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023121037-A1
priorityDate 2013-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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