| abstract |
A resin composition for semiconductor encapsulation comprising a compound (A) comprising at least two glycidyl ether groups and a curing agent, wherein the ionic viscosity is measured with a dielectric analyzer at a measurement temperature of 175 캜 and a measurement frequency of 100 Hz , The appearance time of the lowest ion viscosity is within 5 seconds or more and 40 seconds or less from the start of measurement, the lowest ion viscosity is 4.0 or more and 7.0 or less, and the appearance time of the maximum slope of the ionic viscosity is 10 Sec or more and 60 sec or less, and the maximum slope is 2.0 or more and 6.0 or less. |