| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-7671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-8064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-003 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 |
| filingDate |
2011-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101520202-B1 |
| titleOfInvention |
Resin composition, protective film containing same, dry film, circuit board, and multilayer circuit board |
| abstract |
The present invention aims to provide a resin composition capable of forming a film having excellent heat resistance and sliding and bending property, a protective film of a circuit using the same, and a dry film having the same. It is also an object of the present invention to provide a circuit board and a multilayer circuit board excellent in heat resistance and sliding and bending property. In order to achieve the above object, a protective film comprising a polyoxazolidid resin (A) having a weight average molecular weight of 3 x 10 < 4 > or more is used as a protective film of a circuit board placed in contact with a circuit of a printed circuit board. |
| priorityDate |
2010-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |