http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101519969-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate | 2013-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101519969-B1 |
| titleOfInvention | Pre- wetting device that include Plurality Nozzle |
| abstract | A prewetting apparatus comprising an air flow nozzle is disclosed. A wafer, a pre-wetting part which is provided so as to be capable of approaching and separating from a chuck capable of rotating in a state of being chucked, and prewetting the wafer, a pre-wetting part for injecting liquid or gas for pre- An injecting portion, and a jetting port for jetting the liquid or gas provided from the injecting portion to the wafer, and a plurality of jetting ports are provided on both sides. Nitrogen gas and DI injection holes are provided on both sides of the nozzle to form a high pressure force when spraying the same at the same time so that accelerator penetration is facilitated on the surface of the wafer during the plating process, The risk of breakage of the device can be reduced. |
| priorityDate | 2013-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID947 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556970 |
Total number of triples: 15.