http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101517409-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_509a91658600fa5a6465bee5c0229cb4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07307 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0433 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2014-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45ea597464c5be212d19579d29b5febd |
| publicationDate | 2015-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101517409-B1 |
| titleOfInvention | Semiconductor test socket and manufacturing method thereof |
| abstract | The present invention relates to a semiconductor test socket and a method of manufacturing the same. A semiconductor test socket according to the present invention includes a plurality of unit modules sequentially arranged in a lateral direction; Wherein each of the unit modules includes an insulating main body having elasticity, an insulating sheet positioned inside the insulating main body, a plurality of central conductive plates spaced from each other along the depth direction on one surface of the insulating sheet, A plurality of upper conductive pins attached to the middle conductive plate and exposed on the upper surface of the insulating main body so as to be arranged to be spaced apart from each other in the depth direction; And a plurality of lower conductive pins exposed on the lower surface of the insulating main body so that the other side of the lower conductive pin is arranged to be spaced apart from each other in the depth direction. Accordingly, the disadvantages of the pogo-pin type semiconductor test socket and the disadvantage of the PCR socket type semiconductor test socket can be overcome, thereby enabling the implementation of the fine pattern and overcoming the thickness restriction in the height direction. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017061656-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101729538-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101728399-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170140083-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101757617-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101747652-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101755553-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101775983-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101928192-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101799309-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109585317-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109585317-A |
| priorityDate | 2014-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.