| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P5-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate |
2013-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101508422-B1 |
| titleOfInvention |
Methods and apparatus for transmission lines in packages |
| abstract |
A method and apparatus for forming a semiconductor device package with a transmission line using a microbump layer are disclosed. The micro-bump layer may include micro-bumps and micro-bump lines formed between the upper and lower elements. The signal transmission line may be formed using a micro bump line on the lower element. The ground plane may be formed using a redistribution layer (RDL) in the bottom element, or using an additional microbump line. The ground plane formed by the RDL may include an open slot. There may be RDLs in the bottom and top elements above and below the microbump line to form the ground plane portion. |
| priorityDate |
2013-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |