| abstract |
Provided is an electrical connecting body capable of uniformly crushing the conductive particles contained in the anisotropic conductive film even when the particle diameter is small, and obtaining good conduction characteristics. The electrical connecting body is constituted such that a semiconductor element 1 as a first electronic member and a wiring substrate 3 as a second electronic member are electrically connected via an anisotropic conductive film 5. Bumps (protruding electrodes) 2 are formed on one of the electronic members (here, the semiconductor element 1), and the tops of the bumps 2 are flat surfaces having a surface roughness Ra of 0.05 m or less. The average particle diameter of the conductive particles 6 contained in the anisotropic conductive film 5 is 4 占 퐉 or less.n n n n A semiconductor element, a wiring board, an anisotropic conductive film, |