| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2009-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101502653-B1 |
| titleOfInvention |
Laminate, circuit board and semiconductor device |
| abstract |
The laminated sheet according to the present invention is a laminated board comprising an insulating resin layer and a metal foil in contact with the insulating resin layer, wherein the metal foil has a tensile modulus (A) at 25 캜 of 30 ㎬ to 60,, a thermal expansion coefficient ) Is 10 ppm or more and 30 ppm or less and the bending modulus (C) of the insulating resin layer at 25 캜 is 20 ㎬ or more and 35 ㎬ or less and the thermal expansion coefficient in the XY direction at 25 캜 to Tg of the insulating resin layer (D ) Is 5 ppm or more and 15 ppm or less, the interface stress between the insulating resin layer and the metal foil represented by the following formula (1) is 7 x 10 4 or less. [Equation 1] |
| priorityDate |
2008-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |