| abstract |
The semiconductor package has a semiconductor die (14) disposed on a substrate (12). The bond wires 26 are connected between the first bonding site 22 on the semiconductor die 14 and the second bonding site 32 on the substrate 12. The first bonding site 22 is a die bond pad. The second bonding site 32 is a stitch bond 54. [ The second bonding site 32 includes a bond finger 32 formed on the substrate 12, a conductive layer 252 in direct physical contact with the bond finger 32, And a bond stud 252 physically in direct contact with the conductive layer 252 for coupling to the finger 32 and coupled to the bond wire 26. The bond fingers 32 are made of copper. Conductive layer 252 is made of copper or gold. The bond stud 252 is made of gold and covers the sides and top of the copper layer 212.n n n n Substrate, semiconductor die, bonding site, bond wire, bond finger, semiconductor package |