http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101492463-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate | 2014-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101492463-B1 |
| titleOfInvention | Wafer laminated body and method for bonding and debonding |
| abstract | The present invention relates to a laminate including a device wafer bonded on a transparent support, and a method of bonding and debonding the transparent support and a device wafer, and more particularly, to a method of bonding and disposing a device wafer, And a photocurable temporary adhesion layer for temporarily bonding the device wafer and the transparent support to each other, wherein the device wafer is not damaged and the process time is shortened to enable more efficient bonding and debonding treatment . |
| priorityDate | 2014-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.