http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101492371-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2421-006 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2014-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101492371-B1 |
| titleOfInvention | Heat-peelable pressure-sensitive adhesive tape and cutting method of electronic components |
| abstract | It is an adhesive tape that can fix chips sufficiently even after cutting. It prevents chip scattering during cutting and improves the yield when chips are cut. (1) when the probe tack value of the thermally expansible pressure-sensitive adhesive layer is B o and the probe tack value after standing for one week under the 0 ° C condition of the thermally expansible pressure-sensitive adhesive layer is B ) Is not more than 19.0%. W = (B o -B) / B o x 100 (1) |
| priorityDate | 2013-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 147.