http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101487708-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101487708-B1 |
| titleOfInvention | Method and apparatus to prewet wafer surface for metallization from electrolyte solution |
| abstract | The present invention improves wetting between the electrolyte and the wafer surface when the electrolyte and the wafer surface are contacted by pretreating the absorbed liquid layer on the entire front surface of the wafer immediately prior to the plating process. The pre-absorbed liquid layer is delivered by transferring vaporized liquid molecules from the vapor state at elevated temperatures (relative to the wafer) and condensing the vaporized liquid molecules onto the wafer surface. |
| priorityDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.