http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101485390-B1

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filingDate 2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101485390-B1
titleOfInvention Epoxy resin curing composition and method of manufacturing the same
abstract The epoxy resin curing composition proposed in the present invention includes a cycloaliphatic epoxy resin, an aromatic diamine curing agent, and a strong acid salt catalyst. The epoxy resin curing composition has a viscosity of 500 to 1,500 cps at room temperature, a tensile elongation after curing of 1.8% or more, and a glass transition temperature of 200 ° C or more. According to the present invention, it is possible to mass-produce a resin applicable to processes such as filament winding, because it has a lower viscosity and a higher heat resistance than conventional epoxy resin curing compositions having heat resistance.
priorityDate 2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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