http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101477446-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G13-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-005 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G13-00 |
| filingDate | 2011-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101477446-B1 |
| titleOfInvention | Gang socket, jig for manufacturing capacitor element that uses said gang socket, method for manufacturing a capacitor element and method for manufacturing a capacitor |
| abstract | According to the present invention, even when the chemical conversion solution or the semiconductor layer forming solution is corrosive, the capacitor element can be manufactured without contaminating the chemical conversion solution or the semiconductor layer forming solution, and even when the heat treatment is performed during the production of the capacitor element Provide a connection socket that can perform heat treatment without hindrance. The connection socket 1 of the present invention includes a plurality of conductive socket body portions 2 having insertion ports 37 formed therein and a plurality of accommodating portions 6 capable of accommodating at least a portion of the socket body portion 2 And an insulating portion 5 in which a plurality of small holes 7 communicating with the bottom surface of the accommodating portion 6 are formed on the lower surface 5b and the insulating portion 5 is made of a material having heat resistance and corrosion resistance At least a part of the socket body portion 2 is received and fixed in the receiving portion 6 of the insulating portion 5 and the insertion port 37 and the small hole 7 are communicated with each other. |
| priorityDate | 2010-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.