| abstract |
There is provided a circuit board manufacturing method capable of effectively forming a metal film layer excellent in the insulating layer and in the adhesion and uniformity in the insulating layer.n n n The method for producing a circuit board includes a water-soluble polymer releasing layer, a metal film layer, and a curable resin composition layer sequentially formed on a support layer, wherein after the curing step of the curable resin composition layer so that the curable resin composition layer is in contact with the substrate, A step of laminating a metal film-adhering film having the water-soluble polymer releasing layer having a peeling property enabling peeling of the water-soluble polymeric releasing layer described above between the polymeric releasing layer and the support layer on a substrate; And removing the water-soluble polymer releasing layer present on the metal film layer by dissolving the water-soluble polymer releasing layer with an aqueous solution.n n n Circuit board, adhesive film, metal film layer, water-soluble polymer release layer, curable resin composition, metal film transfer film |