http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101452856-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e9258c4cb01189b8076cca72ecf73c55 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_656f082477cce89cbeb2af0742a856e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00721d2a65e67445bd4002931c20e795 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57be14cb29148892a7481d1bc1e1e01c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38c128fcb73faa06cfa681c899d4b1da |
| publicationDate | 2014-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101452856-B1 |
| titleOfInvention | Photosensitive adhesive film using a epoxy group containing acrylic copolymer |
| abstract | The present invention relates to a photosensitive adhesive film using an epoxy group-containing acrylic copolymer resin, which comprises a photosensitive adhesive layer; And a protective substrate film layer formed on both sides of the photosensitive adhesive layer, wherein the photosensitive adhesive layer is a layer containing an epoxy-containing acrylic copolymer, a phenol resin, a filler, a curing accelerator, a compound having a hydroxyl group or a carboxyl group, A photosensitive adhesive film containing a photoinitiator and the photosensitive adhesive film. Accordingly, in the method of patterning and bonding with the conventional epoxy adhesive, only the chip portion is patterned using the photosensitive adhesive film, whereby the silicon wafer and the glass substrate can be effectively bonded. |
| priorityDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.