| abstract |
Comprising reacting an aromatic diisocyanate with diimidodicarboxylic acid comprising at least 40 mol% of a compound represented by the following general formula (1) and at least 20 mol% of a compound represented by the following general formula (2) Polyamide-imide resin obtained by:n n n n n n n n Polyamideimide resin, diimidodicarboxylic acid, diisocyanate, flexible substrate, flexible printed circuit board |