http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101431981-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2013-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101431981-B1 |
| titleOfInvention | Printed wiring board |
| abstract | The printed wiring board comprises a core substrate, first and second build-up structures respectively formed on the surfaces of the core, and first and second solder-resist layers formed respectively on the first and second build-up structures. The core substrate includes an insulating substrate, conductive layers on the surfaces of the insulating substrate, and through-hole conductors connecting the conductive layers, wherein the first structure includes an interlayer insulating layer and a conductive layer in the first structure, The structure includes an interlayer insulating layer and a conductive layer in the second structure, wherein a thickness between the outer surfaces of the first and second solder-resist layers is set within a range of 150 mu m or more and less than 380 mu m, 2 structures, at least one of the first and second solder-resist layers comprises a reinforcing material in an amount such that the printed wiring board comprises the reinforcing material in an amount in the range of 20 to 35 percent by volume. |
| priorityDate | 2012-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.