http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101431491-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate | 2008-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101431491-B1 |
| titleOfInvention | Electroless gold plating method and electronic parts |
| abstract | A part or all of the electroless gold-plated film of the electroless nickel plating film, the electroless palladium plating film and the electroless gold plating film of the plated film laminate having the electroless gold plating film is treated with a water-soluble gold compound, a complexing agent and formaldehyde and / or formaldehyde bisulfite Water, a compound of formula R One -NH-C 2 H 4 -NH-R 2 Or R 3 - (CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 Is formed from an electroless gold plating using an electroless gold plating bath containing an amine compound represented by the following formula (1).n n n The method of the present invention does not require preparation of two kinds of baths of a flash gold plating bath and a thickness adhering gold plating bath and is capable of forming a gold plating film having various thicknesses which are judged to be suitable for solder bonding or wire bonding in one kind of gold plating bath In particular, the electroless gold plating film having a thickness of 0.15 占 퐉 or more can be efficiently and effectively formed in one plating bath in one process, which simplifies the process and is cost effective.n n n Electroless, nickel plating, complexing agent, formaldehyde, gold plating, wire bonding. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170018228-A |
| priorityDate | 2007-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.