| abstract |
Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robot handler configured to move a plurality of semiconductor wafers in a chamber between a plurality of sub-chambers is disposed within the chamber. Chambers configured to remove the protective layer from the plurality of semiconductor wafers and a second sub-chamber configured to activate the upper surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together, Sub-chamber. The plurality of sub-chambers also includes a third sub-chamber configured to align the plurality of semiconductor wafers and to hybrid bond the plurality of semiconductor wafers together. |