http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101423400-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
filingDate 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101423400-B1
titleOfInvention Multi-layered printed circuit board and method of manufacturing the same
abstract The present invention relates to a prepreg; And an insulating resin layer formed on one surface of the prepreg and capable of forming an illuminance by a desmearing process, wherein the insulating resin layer comprises (a) polyphenylene ether and 9,9-bis A polyphenylene ether modified resin obtained by a redistribution reaction in the presence of a hydroxyaryl fluorene (BCF); (b) an epoxy resin; (c) a curing agent; (d) at least one modified epoxy resin selected from the group consisting of dimeric acid-modified epoxy resins and urethane-modified epoxy resins; And (e) a flame retardant, and a multilayer printed circuit board comprising the insulating resin sheet and a method of manufacturing the same. In the present invention, it is possible to provide a build-up printed circuit board capable of reducing the total stacking thickness and lowering the interlayer thermal expansion coefficient of the substrate while realizing a high-density micro-circuit pattern.
priorityDate 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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