http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101420939-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101420939-B1 |
| titleOfInvention | Multi-layered printed circuit board and method of manufacturing the same |
| abstract | The present invention relates to a polyimide film; An adhesive layer formed on one surface of the polyimide film; And an insulating resin sheet formed on the other surface of the polyimide film and including an insulating resin layer capable of forming an illuminance by a desmearing process, a multilayer printed circuit board including the insulating resin sheet, and a method of manufacturing the same . The present invention can provide a build-up printed circuit board capable of reducing the total stacking thickness and increasing the degree of design freedom of the substrate while realizing a high-density fine circuit pattern. |
| priorityDate | 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 91.