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filingDate 2012-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101420542-B1
titleOfInvention Epoxy resin composition for insulating film, insulating film for printed circuit board and manufacturing method thereof and printed circuit board having the same
abstract The present invention provides an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board having the same. Specifically, the present invention provides a build-up type printed circuit board in which a skin layer and an illuminance are formed on a surface of an insulating film by using a difference in curing start temperature to improve adhesion strength, However, since the thermal expansion coefficient of the insulating film itself is low, the film is not deformed.
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