abstract |
The present invention provides an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board having the same. Specifically, the present invention provides a build-up type printed circuit board in which a skin layer and an illuminance are formed on a surface of an insulating film by using a difference in curing start temperature to improve adhesion strength, However, since the thermal expansion coefficient of the insulating film itself is low, the film is not deformed. |