http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101419129-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1515 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101419129-B1 |
| titleOfInvention | Photosensitive resin composition, cured film thereof and printed wiring board |
| abstract | The present invention relates to a photosensitive resin composition which is excellent in electroless gold plating resistance and excellent in filling property into a through hole and can obtain a cured product in which defective appearance of a cured coating due to dolby in the through hole is suppressed, And a printed circuit board comprising the cured coating. A photosensitive resin composition comprising (A) a photosensitive carboxylic acid resin and (B) a liquid bifunctional epoxy resin, wherein (C) an aluminum-containing inorganic filler is contained in an amount of 200 parts by mass or more per 100 parts by mass of the total carboxylic acid resin Wherein the photosensitive resin composition is a photosensitive resin composition. |
| priorityDate | 2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 610.