patent/KR-101418264-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101418264-B1

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0454b8157065aa79e639d913ec748f6b
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
filingDate	2013-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2014-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e107d9501ba5c15ee000bd72cb39da85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_772f3c3ab22377c07bae181a35e3d3b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1be58ecf2a49eb9c76ec55c6b17b90d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c6fe54c5adfc0a64d0afc3bc0af443f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f88bf5172f0fbb7483d8ae47be17f73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66b7e74de6858848ba9e6b23f49fe1b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb6c7ab73fd1b46e76f0b3938b1fb458
publicationDate	2014-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-101418264-B1
titleOfInvention	Semiconductor package manufacturing method
abstract	A semiconductor package of the present invention comprises a semiconductor die bonded on a substrate through a bump, a film type high temperature EMC molding member for molding and embedding the semiconductor die, and a lead bonded on the high temperature EMC molding member, The EMC molding member can function as a heat transfer member.
priorityDate	2013-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050072421-A
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099531 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6335491

Total number of triples: 33.