http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101418194-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-1676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 |
| filingDate | 2011-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101418194-B1 |
| titleOfInvention | SURFACE TREATMENT AGENT FOR Pd OR ALLOY MAINLY COMPOSED OF Pd, AND SURFACE COATING LAYER STRUCTURE OF COPPER SURFACE |
| abstract | An object of the present invention is to provide a surface treatment agent which suppresses oxidation of Pd or an alloy surface containing it as a main component and improves solderability such as solder wettability and solderability and contact properties. It is another object of the present invention to provide a surface treatment agent for obtaining a connector terminal that is resistant to mechanical wear, has less decrease in coating due to abrasion, and is stable. The surface treatment agent of the present invention is a surface treatment agent which comprises at least one compound selected from the group consisting of a compound having two or more phosphonic acid groups in one molecule and containing no ester bond in the molecule and / And 0.01 g / L or more in a solvent. The surface treatment agent is an alloy containing Pd or Pd as a main component. The surface coating layer structure of the present invention is characterized in that an Ni film, a Pd film or an alloy film containing Pd as a main component is formed on the copper surface, and an organic film is further formed on the surface of the alloy film using the surface treatment agent It is the surface coat layer structure of copper surface. |
| priorityDate | 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.