| abstract |
A polyimide resin which is soluble in an organic solvent and has a low water absorption rate, a high thermoplasticity, a high heat resistance and an excellent adhesiveness, a process for producing the same, an adhesive comprising the polyimide resin, a film and a metal film including an adhesive layer comprising the polyimide resin Thereby providing a laminate. A polyimide resin having a repeating unit represented by the following formula (1) and a repeating unit represented by the formula (2), wherein the group represented by the following formula (3) in the whole X is 50 mol% or more. |