http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101406276-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76865 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate | 2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101406276-B1 |
| titleOfInvention | METAL WIRING OF SEMICONDUCTOR DEVICE |
| abstract | The present invention provides a metal wiring of a semiconductor device and a method of forming the same. Providing a substrate on which electrodes are formed, forming a mold film having grooves that expose electrodes on the substrate, forming a conductive film that conformally covers the bottom and sidewalls of the grooves and is connected to the electrodes, A method for forming a metal wiring of a semiconductor device, comprising forming a seed metal film confined on a bottom of a groove, and forming a metal pattern that is grown from the seed metal film to fill the groove, and a semiconductor device Metal wiring is provided.n n n n Metal wiring, groove, mold film |
| priorityDate | 2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.