http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101400473-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 |
| filingDate | 2010-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101400473-B1 |
| titleOfInvention | COMPOSITION FOR FORMING EPOXY CURING RESIN |
| abstract | An object of the present invention is to provide a composition for an epoxy cured resin capable of effectively suppressing a curing reaction at a low temperature to improve the stability of the one-part liquid and curing the resin effectively by performing a heat treatment. The present invention is a composition for forming an epoxy cured resin, which comprises the following components (A), (B) and (C). (A) Epoxy resin (B) Formula (I) R (COOH) n (I) , A carboxylic acid derivative represented by the formula (II) (C) an imidazole compound represented by the formula (III) Is a tetrakisphenol-based compound. |
| priorityDate | 2009-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 638.